Congatec unveiled a “Conga-TCV2” Sort 6 module with AMD’s Ryzen Embedded V2000 SoC. The corporate additionally launched six -40 to 85°C variations of its Sort 6 and COM-HPC Tiger Lake modules and previewed a COM-HPC service.
Congatec has introduced a Conga-TCV2 module with AMD’s Ryzen Embedded V2000 SoC that competes with with Adlink’s equally COM Categorical Compact Sort 6 cExpress-AR module. The Linux-ready module exploits V2000 tech advances reminiscent of 64GB RAM assist, 2.5GbE Ethernet, USB 3.1 Gen2, and extra PCIe Gen3 lanes.
The German embedded vendor additionally introduced a half dozen industrial temperature variants of its Tiger Lake primarily based Conga-TC570 Sort 6 and Conga-HPC/cTLU COM-HPC modules and previewed an ATX form-factor Conga-HPC/EVAL-Consumer service. We cowl this information farther under together with Advantech’s preview of its personal COM-HPC module and service and new Congatec initiatives in fog computing and a TSN/TCC.
Like Adlink’s cExpress-AR, the Conga-TCV2 presents a alternative of the 4 new Ryzen Embedded V1000 fashions on a 95 x 95mm Compact Sort 6 type issue. The module follows Congatec’s V1000-based, Fundamental Sort 6 Conga-TR4 module.
AMD’s Ryzen Embedded V2000, which will even seem on some ASRock and Ibase SBCs and compact embedded programs, advances to 7nm-fabricated Zen 2 cores in comparison with the 14nm Zen 1 cores on the Ryzen Embedded V1000 and R1000. The V2000 doubles the multi-threaded performance-per-watt in comparison with the V1000 and presents as much as 30 p.c higher single-thread CPU efficiency, claims AMD. Graphics efficiency is claimed to be 40 p.c greater.
AMD introduced two hexa-core and two octa-core fashions led by a V2748 with 2.9GHz base and 4.25GHz enhance charges and a 35-54W TDP. Two of the fashions provide 10-25W TDPs. The Radeon graphics cores present 6x or 8x CPU cores and as much as 1.6GHz clock speeds. Different options embrace improved safety features and as much as 20x PCIe Gen3 lanes.
Conga-TCV2 render (left) and Ryzen Embedded V2000 specs
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Just like the cExpress-AR, the Conga-TCV2 helps as much as 64GB DDR4-3200 and presents a 2.5GbE Ethernet controller, on this case enabled with TSN. The module presents 8x PCIe Gen3 lanes, in comparison with 6x on the Adlink module, and equally supplies PCIe x8 Gen2 by way of PEG pins. Then again, the module is proscribed to 2x USB 3.2 Gen2 interfaces in comparison with as much as 4x on the cExpress-AR.
The Conga-TCV2 equally helps quadruple 4KP60 shows. It presents triple DDI (DP 1.4/HDMI 2.1/DP++) and optionally available eDP instead of LVDS. Audio options embrace HDA audio, I2S, and 2x Soundwire.
Further peripheral assist contains 2x SATA III, 8x USB 2.0, 2x UART, 8x GPIO, and SPI. A Congatec Boad Controller supplies a watchdog, I2C, HW monitoring, and extra. The module helps TPM 2.0, ACPI 5.Zero energy administration with battery assist, and a Zero to 60°C working vary with 10-90% non-condensing relative humidity tolerance.
The Conga-TCV2 helps Linux/Yocto, Android Q, Home windows 10, and Wind River VxWorks. The module additionally helps Actual-Time Techniques’ RTS Hypervisor, which permits functions together with digitization and parallel-processed edge analytics with workload balancing and consolidation. Different functions embrace industrial and thin-client programs, robotics, autonomous autos, and e-mobility.
New Tiger Lake modules
Congatec’s early September announcement of its Intel 11th Gen Tiger Lake ULP3 primarily based COM-HPC form-factor Conga-HPC/cTLU and Compact Sort 6 Conga-TC570 modules was adopted by an early October replace announcement revealing further SKUs for the modules with embedded centered “E” and “GRE” Tiger Lake fashions. Congatec has now added three new E and GRE variants for every module.
Conga-HPC/cTLU (left) and Conga-TC570
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The brand new modules bump the prolonged temperature assist as much as an industrial -40 to 85°C vary. Like the sooner E and GRE variants, the SKUs present prolonged buy availability and barely decrease base and Turbo frequencies than the usual fashions.
Congatec and Advantech preview COM-HPC carriers
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The Conga-HPC/cTLU will be capable of plug right into a newly introduced Conga-HPC/EVAL-Consumer service board. The ATX board helps COM-HPC sizes A, B, and C and will likely be accessible with three totally different cooling choices.
The Conga-HPC/EVAL-Consumer will provide modular Ethernet assist with choices together with Ethernet KR, as much as 2x 10 GbE, 2.5GbE, and 1GbE. The board additionally options 2x “massively performant” PCIe Gen4 x16 connectors that allow add-on playing cards as much as “4×25 GbE.” It’s unclear if which means 4 2.5GbE ports or 4 25GbE ports. Intel’s 10nm Tiger Lake platform is notable for its assist for PCIe Gen4, amongst different options together with USB 4 (Thunderbolt 4) assist and vastly improved Iris Xe graphics with 4x 4K assist.
Conga-HPC/EVAL-Consumer render (left) and Advantech SOM-DB8900 with SOM-8990 module beneath the cooler
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We missed Advantech’s early September announcement of its endorsement of the COM-HPC normal, however this week, Embedded Computing Design launched an analogous announcement on behalf of Advantech. Each bulletins reveal an upcoming, Intel Xeon D primarily based SOM-8990 module and SOM-DB8900 service that adjust to the COM-HPC Server spec somewhat than the Consumer mannequin utilized by Congatec.
Developed by Adlink, Congatec, and Kontron, COM-HPC supplies 800 interface pins, up from 440 on COM Categorical. The spec doesn’t change Sort 7, however is mostly thought of a successor required for platforms with higher-bandwidth PCIe and USB connections, reminiscent of Tiger Lake.
Advantech’s SOM-8990 module and SOM-DB8900 service will assist the 16-core Xeon D with as much as 512GB RAM and 45 lanes of PCIe Gen3. Different options embrace 1GbE, 4x 10GBASE-KR (10GbE), 4x USB 3.0, and 2x SATA III. The SOM-8990 additionally exhibits up on this Advantech COM product transient (PDF).
Lastly, Congatec launched a pair of imprecise bulletins that seem to narrate primarily to the Tiger Lake modules. First, it introduced assist for fog computing for high-end edge servers operating on COM-HPC and COM Categorical Sort 7 modules.
The corporate additionally introduced assist for Time Delicate Networking (TSN) and Intel’s associated Time Coordinated Computing (Intel TCC), that are each accessible on many Tiger Lake and Elkhart Lake Atom x6000E fashions. (In September, Congatec introduced a Conga-PA7 Pico-ITX SBC primarily based on Elkhart Lake.)
Congatec has up to date its TSN Demo system so as to add assist for TCC and “further time stamp counter (TSC) features, which handle the synchronized execution of operations all the way down to the I/Os in real-time.” The demo system incorporates a 2.5GbE Intel I225 controller and helps the RTS Hypervisor.
“Whereas TSN orchestrates the totally different actors — a bit just like the conductor and his orchestra — by setting the community time, TCC expertise ensures that the totally different actors execute their operations precisely when they’re alleged to,” acknowledged Martin Danzer, Director Product Administration at Congatec.
No pricing or availability info was offered for the Conga-TCV2 module with Ryzen Embedded V1000. Extra info could also be present in Congatec’s announcement and product web page. Different Congatec bulletins relating to the commercial temperature Tiger Lake modules, Conga-HPC/EVAL-Consumer, and fog computing and TSN/TCC initiatives could also be discovered within the hyperlinks farther above.